The semiconductor refrigeration module harnesses the principles of the Peltier Thermoelectric Effect to create a controlled low-temperature environment, particularly beneficial for ensuring the efficient and stable operation of CPUs. With dimensions of 30305mm, it's designed to operate at a rated voltage of 5V and a rated current of 1A. Offering instantaneous refrigeration capabilities without generating noise or vibration, it can effectively lower temperatures to as low as -20℃. Its versatility extends to applications in environments with space constraints, demanding reliability criteria, and in the creation of portable refrigeration systems, incubators, hot and cold water dispensers, and cooling electronic devices.

Features:

• Peltier Thermoelectric Effect: Utilizes this phenomenon for efficient refrigeration.
• Rated Voltage and Current: Operates at 5V and 1A respectively.
• Compact Size: Measures 30305mm, ideal for installations where space is limited.
• Instantaneous Refrigeration: Provides quick cooling capabilities upon activation.
• Stable Performance: Ensures consistent operation without generating noise or vibration.
• Temperature Reduction: Capable of lowering temperatures to as low as -20℃ for effective cooling.

Specifications:

• Maximum Voltage: 8.4V
• Operating Voltage: 5V
• Maximum Current: 2A
• Maximum Temperature Differential: Exceeds 65°C
• Operating Temperature Range: -55℃ to 83℃
• Dimension: 30305mm / 1.181.180.20”
• Wire Length: 150±8mm (Red & Black wire)

Applications:

• CPU Cooling: Ensures optimal operating temperatures for CPUs and electronic devices.
• Portable Refrigeration Systems: Ideal for creating compact and mobile cooling solutions.
• Incubators: Maintains precise temperature control for biological incubation processes.
• Hot and Cold Water Dispensers: Regulates water temperatures for various applications.
• Space-Constrained Environments: Suitable for installations where space is limited.
• High-Reliability Scenarios: Meets demanding reliability criteria for critical applications.

Note:

•  The side with words is for cooling, and the side without words is for dissipating heat.
• Heat side requires a heat sink or water-cooled heat dissipation device all the time, otherwise, there is a risk of burnout.

Package Includes: